Our production facilities are fully up to date. Thanks to the adjustable design of our lines, we can easily implement special solutions.
Reflow soldering technology
In a protective
We have the latest generation reflow soldering systems. In particular with regard to temperature zones, they are exceedingly efficient. The soldering process takes place in a protective atmosphere.
In the reflow soldering process, we process through-hole and SMD components. The number of work stages, sources of error and thermal loads is reduced. In the reflow process we are also able to solder through-hole components, thereby reducing sources of error and repeated thermal load and work stages.
So you want to achieve compact shapes for complex components? Our test and programming service is there for you. The system we use keeps line contact high, offers perfect access and ensures precise bonding.
The advantages for you: flexible program selection until shortly before the start of production, no extra expenditure for external programming.
Printing the soldering paste takes place using the latest soldering paste stencil printers. They are so exact that even the tiniest elements can be precisely placed.
The faultless print result is reliably assured with a 3D paste inspection.
Pick & place
High-performance placement machines by ASM with short setup times and high flexibility form the backbone of our automated SMD placement systems. Our services also include assembly of THR components (pin-in-paste technology).
Extensive monitoring systems and built-in cameras ensure high precision in the placement process.
Precise, customer-specific, economical
The 3D automatic optical inspection of SMD components combines 2D and 3D inspection at maximum speed. Some of our machines allow an inspection in 360 ° steps.
Depending on the machine, excellent dynamic properties and the highest positioning speed can be achieved on the basis of linear drives.